J. Daniel Garcia is a Full Professor in Computer Science and Artifical Intelligence at the Department of Computer Science and Engineering of University Carlos III of Madrid. He holds a PhD in Informatics Engineering from University Carlos III of Madrid and a Bachelor in Computer Science from Madrid Technical University. Before joining University he worked in projects for companies like Telefonica, British Telecom, FCC, Siemens or ING Bank. He has been Visiting Faculty at University of Texas A&M (United States, 2012-2013) and Visiting Researcher at University of Modena (Italy, 2007). He is a member of ACM and a Senior Member of IEEE.
He has co-authored more that 80 papers in international journals and conferences. Additionally, he has participated in 23 competitive funding projects and 15 research and technology transfer contracts with companies. He has been advisor in 6 PhD thesis in the area of High Performance Computing, Parallel Programming, and Programming Models.
His research activity is focused in the research line of Programming Models for Application Improvement. His main goal is to make software developers lives easier by improving balance between performance improvement and maintainability with a special focus to multi-core processors and parallel heterogeneous computing systems.
Since 2008 he is the Spanish representative in committee ISO/IEC JTC1/SC22/WG21 in charge of standardizing the C++ programming language. At the national level, he is the chair of subcommittee CTN71/SC22 (programming languages, its environment and systems software interfaces) and CTN1/SC22/GT21 (C++ language). Since 2008 he has actively contributed in the wording of all international standards related to the C++ programming language.
His teaching activity covers Bachelor and Masters courses in Computer Architecture, Operating Systems, and High Performance Programming. He has co-authored three academic books in Computer Structure and Programming in the C++ language. He has also co-authored several courses in the OpenCourseWare-UC3M initiative.